Intel Dual Band Wireless-AC 3160 (3160SDW)

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multiple revisions of this device, use caution
abgn+ac (AC600)
802.11a/b/g/n/ac + BT4.0 module
Support
Platform
BrandModelRev
Intel Dual Band Wireless-AC 3160
Model Part Number
3160SDW
Interface
M.2 2.0
Connector
SD (solder down)
Form factor
M.2 2226 (module)
FCCID
ICID
Chip1
Intel W516AK1N

OUI: 00:15:00 (-, 7 W)

Antenna Connection
MHF4
MIMO status
1x1:1
Wireless Standards
IEEE 802.11a/b/g/n/ac
802.11ac
up to 433 Mbps
802.11n
up to 150/150 Mbps
802.11g
up to 54 Mbps
802.11b
up to 11 Mbps
802.11a
up to 54 Mbps
Operating Frequency
2.4 or 5 GHz
Other
Flags:
Bluetooth 4.0, DFS

Probable Linux driver
iwlwifi, k3.10+ (in backports)
(see also passys)

Retail
FCC approval date 29 January 2014
Country of manuf China
 Chip1 brandChip2 brand
Intel Dual Band Wireless-AC 3160 (3160HMW)Intel
Intel Dual Band Wireless-AC 3160 (3160NGW)Intel
Intel Dual Band Wireless-AC 3160 (3160SDW)Intel

For a list of all currently documented Intel chipsets with specifications, see Intel.

For a list of all currently documented Intel device with specifications, see Intel.

433 Mbps - 1SS 5GHz 802.11ac (80MHz chan.),
150 Mbps - 1SS 2.4GHz 802.11n (40MHz chan.) = AC600 class

Overview

BT 4.0, PCIe, USB, NGFF (M.2 2226)

SDW (Solder Down) Module

W516AK1N chip P/N?

The EUT has a Wi-Fi and BT MAC OUI of 00:15:00.

The TA of the EUT is H27868-002.
  • 3160HMW - 802.11ac, 1x1, Bluetooth 4.0, PCIe, USB, HMC (Mini PCIe)
  • 3160NGW - 802.11ac, 1x1, Bluetooth 4.0, PCIe, USB, M.2 2230 (NGFF)
  • 3160SDW - 802.11ac, 1x1, Bluetooth 4.0, PCIe, USB, M.2 2226 (Solder Down)

Links of Interest

Product Brief  • ARK