D-Link DWL-900AP+ rev A
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Jump to navigationJump to searchb (B11) | |||||||||||||||||
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Wireless Access Point | |||||||||||||||||
Support | |||||||||||||||||
Wikipedia | |||||||||||||||||
WikiDevi.wi-cat.ru | |||||||||||||||||
3rd Party Firmware | |||||||||||||||||
dd-wrt | |||||||||||||||||
OpenWrt |
Incompatible | ||||||||||||||||
Tomato any flavor |
Incompatible | ||||||||||||||||
Platform | |||||||||||||||||
Brand • Model • Rev |
D-Link DWL-900AP+ A | ||||||||||||||||
FCC ID | |||||||||||||||||
Type |
access point | ||||||||||||||||
CPU1 |
Samsung S3C4510B | ||||||||||||||||
CPU1 Type |
ARM7TDMI-S | ||||||||||||||||
CPU1 Speed |
200 MHz 32-bit | ||||||||||||||||
Flash1 Chip |
Macronix MX29LV800BTC-90 | ||||||||||||||||
Flash1 Size |
1 MiB1,048,576 B <br />8,192 Kib <br />1,024 KiB <br />8 Mib <br />9.765625e-4 GiB <br /> | ||||||||||||||||
RAM1 Size |
8 MiB8,388,608 B <br />65,536 Kib <br />8,192 KiB <br />64 Mib <br />0.00781 GiB <br /> | ||||||||||||||||
RAM1 Chip |
Winbond W986432DH-5 | ||||||||||||||||
ETH chip1 |
Samsung S3C4510B | ||||||||||||||||
ETH chip2 |
VIA VT6103 | ||||||||||||||||
Ethernet Port Count |
1-100MbE-LAN | ||||||||||||||||
Wired Standard |
IEEE 802.3i/3u | ||||||||||||||||
Expansion IF types |
PCMCIA (16-bit) | ||||||||||||||||
PCMCIA slots |
1 | ||||||||||||||||
Power |
5 VDC, 2 A | ||||||||||||||||
Connector type |
barrel | ||||||||||||||||
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Retail | |||||||||||||||||
Availability | common | ||||||||||||||||
FCC approval date | 16 August 2002 | ||||||||||||||||
Radio 1 | |||||||||||||||||
Radio1 module |
unknown | ||||||||||||||||
Radio1 module IF |
PCMCIA (16-bit) | ||||||||||||||||
Chip1 | |||||||||||||||||
Chip2 |
RFMD Model? | ||||||||||||||||
Wireless interface OUI |
00:40:05 | ||||||||||||||||
Antenna Connector Type |
RP-SMA | ||||||||||||||||
Wireless Standard |
IEEE 802.11b | ||||||||||||||||
802.11b |
up to 11 Mbps | ||||||||||||||||
WiFi Operating Frequency |
2.4 GHz | ||||||||||||||||
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For a list of all currently documented RFMD (Qorvo) chipsets with specifications, see RFMD.
For a list of all currently documented Samsung chipsets with specifications, see Samsung.
For a list of all currently documented Texas Instruments (TI) chipsets with specifications, see Texas Instruments.
For a list of all currently documented VIA chipsets with specifications, see VIA.
For a list of all currently documented D-Link device with specifications, see D-Link.
- • 11 Mbps - 2.4GHz 802.11b = B11 class
Overview
OEM Global Sun GL2422AP-0T4
see Hacking the DWL-900AP+ (via archive.org) and the DWL-900AP+ page on Seattle Wireless
It appears the FCC ID some units (perhaps all or most A revision units, at least A2) is O7J-GL242204-0T.
CPU is part S3C4510B01-QERO.
Categories:
- D-Link
- Embedded system/access point
- Embedded System Samsung
- Embedded System S3C4510B
- Samsung
- Embedded System ARM7TDMI-S
- Embedded System
- Embedded System VT6103
- Embedded System VIA
- VIA
- Embedded System Texas Instruments
- Embedded System ACX100
- Texas Instruments
- Embedded System RFMD
- RFMD
- Embedded System IEEE 802.11b
- Single-Radio Wireless Embedded System
- Wireless Embedded System
- English Documentation