Z-Com LANEscape APDL-325

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Platform
BrandModelRev
Z-Com LANEscape APDL-325
Interface
PCMCIA (16-bit)
Connector
PCMCIA (16-bit)
FCCID
Chipset
Intersil PRISM 2.5
Chip1
Intersil ISL3873B
Chip2
Intersil ISL3685

OUI: 00:60:B3 (5 E, 47 W)

Antenna Connection
RP-MMCX
Wireless Standards
IEEE 802.11b

Probable Linux driver
unknown unknown

Retail
FCC approval date 20 August 2001
Country of manuf Taiwan
 FCC ID
@Road iWM3130PDC-IWM313XSM
M4Y-000325
Billion BiPAC 643QI3-643-200
M4Y-000325
Siemens SS2524M4Y-000325
Siemens SS2624 v2M4Y-000325
Z-Com XI-325M4Y-000325
M4Y-03251
MYF-XI-325
MYF-XI-325X

For a list of all currently documented Intersil chipsets with specifications, see Intersil.

For a list of all currently documented Z-Com device with specifications, see Z-Com.

This device was used in at least some D-Link DI-713P units. The below picture is from a module pulled from a DI-713P.

Project: DI-713P (APDL-325) (via archive.org)

"XI-325 V20 18.12."?? and "70-050002-20" is silkscreened on the board.

XI-325 specifications RF output power

  • 15 dBm (max)

Typical Receiver Sensitivity w/ 11b rates (more)

  • -92 dBm @ 1M
  • -89 dBm @ 2M
  • -88 dBm @ 5.5M
  • -85 dBm @ 11M

Images

Z-Com LANEscape APDL-325.jpg