Nintendo

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https://www.nintendo.com

Devices

Device Type PHY modes Manuf. CPU1 FLA1 RAM1 Radio1 Radio2 Switch Ether. Expan. Ports FCC date
Nintendo 2DS (FTR-001)
FCC ID: BKEFTR001N
portable game console bg

G54
unk. Atheros
AR6012
?x?:?, bg
Ant. conn: none specified
short-term conf template expired 2014-05-06
Nintendo 3DS (CTR-001)
FCC ID: EW4DWMW028, MCLJ27H023
portable game console bg

G54
Foxconn

CoO: Sample PRC Flag.svg
Nintendo
CPU CTR
268 MHz

2 cores
1,024 MiB1,073,741,824 B <br />8,388,608 Kib <br />1,048,576 KiB <br />8,192 Mib <br />1 GiB <br /> 128 MiB134,217,728 B <br />1,048,576 Kib <br />131,072 KiB <br />1,024 Mib <br />0.125 GiB <br /> Atheros
AR6014G
?x?:?, bg
Ant. conn: U.FL

Is a module
Mitsumi DWM-W028
IrDA

SD Card slot

Speaker

Microphone

2010-04-30
Nintendo Switch
FCC ID: BKEHAC001
portable game console abgn+ac

AC1200
Foxconn

CoO: Sample PRC Flag.svg
nVIDIA
Tegra X1
1.0 GHz

8 cores
32,768 MiB34,359,738,368 B <br />268,435,456 Kib <br />33,554,432 KiB <br />262,144 Mib <br />32 GiB <br /> 4,096 MiB4,294,967,296 B <br />33,554,432 Kib <br />4,194,304 KiB <br />32,768 Mib <br />4 GiB <br /> Broadcom
BCM4356
2x2:2, abgn+ac
Ant. conn: U.FL

Is a module
ALC5639, PI3USB30532, MAX77621AEWI+T, MAX77620AEWJ+T, MAX, BCM20734, NFCBEA, MX25U4033E Bluetooth 4.1

SD Card slot

Audio 3.5 mm jack

speakers

fan

2016-12-25
Nintendo Wi-Fi USB Connector
FCC ID: FDI-04600022-0
bg

G54
Gemtek

WUBR-134GM
CoO: Sample PRC Flag.svg
unk. unk. 2005-10-24

Models

Nintendo 1446 17 CPU LGR A - CPU (ARM core)
Samsung KLM4G1YEMD-B031 4GB - NAND Flash
Fujitsu 82MK9A9A 7LFCRAM 1445 962 - FCRAM
Atheros AR6014G-AL1C - Wi-Fi SoC
Texas Instruments 93045A4 49AF3NW G2 - PMIC
Renesas Electronics UC KTR 442KM13 TK14 - MCU
Texas Instruments AIC3010D 48C01JW - Codec IC
NXP S750 1603 TSD438C - Infrared IC
Texas Instruments PH416A - I/O Expander

Nintendo 1446 17 CPU LGR A - CPU (ARM Core)
Samsung KLM4G1YEMD-B031 4GB - NAND Flash
Fujitsu 82MK9A9A 7LFCRAM 1445 962 - FCRAM
Atheros AR6014G-AL1C - Wi-Fi SoC
NXP S750 1603 TSD438C - Infrared IC

• CPU: ARM11 MPCore @268MHz, ARM9 @134MHz
• GPU: DMP PICA200 @268MHz
• Flash: Toshiba THGBM2G3P1FBAI8 1GB
• RAM: Fujitsu MB82M8080-07L 128MB (2x 64MB)
• Wi-Fi: Atheros AR6014G-AL1C - Wi-Fi SoC
• FCC ID: EW4DWMW028 (Mitsumi DWM-W028)
• Audio: Texas Instruments AIC3010B (Codec IC)
• Gyroscope: Invensense ITG-3270 MEMS
• Accelerometer: STMicro LIS331DH


System-on-chip used: Nvidia Tegra X1 @1.02GHz
CPU: Quad-core Cortex-A57 + Quad-core Cortex-A53
Memory: 4GB LPDDR4; Storage: 32GB eMMC
Removable storage: microSD/HC/XC (up to 2TB)
Display: 6.2" 1280×720p LCD (237ppi)
Up to 1080p via HDMI while docked

• CPU: Allwinner R16 (Quad Core ARM Cortex-A7)
• GPU: Mali-400MP2; Flash: Macronix (NAND); RAM: Nanya

Models Specifications

Type 3DS 3DS XL 2DS N3DS N3DS XL N2DS XL
Model CTR-001 SPR-001 FTR-001 KTR-001 RED-001 JAN-001
CPU
(SoC)
CPU CTR (1048 0H)
CPU CTR (1214 32)
CPU CTR A (1226 60)
CPU CTR (1037 21)
CPU CTR B
(??)
CPU LGR A
(1444 86)
CPU LGR A
(1446 17)
CPU LGR A
RAM
(FCRAM)
Fujitsu
MB82M8080-07L
128MB (2x 64MB)
Fujitsu
MB82DBS16641
Fujitsu
MB82DBS1664
?? Fujitsu
MB82MK9A9A
Fujitsu
MB82MK9A9A
Flash
(Storage)
Toshiba
THGBM2G3P1FBAI8
1GB
Changed between
O3DS and N3DS
parts depending
on production date
Samsung KLM4G1YEQC 4GB
(in 1.3GiB SLC mode) or
Toshiba THGBMBG4P1KBAIT 2GB
(MLC, appr. 1.8GB usable)
??
Speaker,
Microphone,
Circlepad,
Touch controller
TI PAIC3010B
0AA37DW
?? ?? TI AIC3010B
39C4ETW
TI AIC3010D
48C01JW
??
Gyroscope Invensense
ITG-3270 MEMS
?? ?? ?? ?? ??
Accelerometer STMicro LIS331DH
2048 33DH X1MAQ
?? ?? ?? ?? ??
Wi-Fi Atheros
AR6014G-AL1C
?? Atheros
AR6012
?? Atheros
AR6014G-AL1C
??
Infrared IC NXP S750
0803 TSD031C
?? ?? ?? NXP S750
1603 TSD438C
??
Custom MCU Renesas UC CTR ?? Renesas UC CTR
324KM47 KG10
Renesas UC KTR Renesas UC KTR
442KM13 TK14
??
Power
(PMIC)
TI 93045A4
OAAH86W
?? ?? TI 93045A4
38A6TYW G2
TI 93045A4
49AF3NW G2
??
Wi-Fi
SPI Flash
Raw ID data:
20 58
?? ?? Raw ID data:
62 62
?? ??
Top
Screen
3.53" in, 3D 4.88" in, 3D 3.53" in 3.88" in, 3D 4.88" in, 3D 4.88" in (?)
Bottom
Screen
3.00" in 4.18" in 3.00" in 3.33" in 4.18" in 4.18" in (?)
  • [11] Official Documentation
  • [5], [10] According to iFixit.com (Teardown):
  • Datasheet for memory is for a chip in the same series, it has less
memory than the one inside the 3DS (128MB vs 512MB).
  • There is a trove of data on the FCC website at EW4DWMW028.
  • [12] This IC is somewhat similar to NXP.
  • The Raw ID data for Wi-Fi SPI Flash is from command 0x9F, RDID.