Foxconn WIN-A2

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bgn (N150)
802.11n Wireless Module
Platform
BrandModelRev
Foxconn WIN-A2
Interface
SDIO
Connector
SDIO
Form factor
(module)
ID:02d0:a962
FCCID
ICID
Chip1
Broadcom BCM43362

OUI: none specified

Antenna Connection
U.FL
MIMO status
1x1:1
Wireless Standards
IEEE 802.11b/g/n
802.11n
up to 150 Mbps
802.11g
up to 54 Mbps
802.11b
up to 11 Mbps
Operating Frequency
2.4 GHz
Other
Manuf/OEM/ODM

Probable Linux driver
brcmfmac (SDIO in backports)
(see also passys)

Retail
FCC approval date 07 March 2011

For a list of all currently documented Broadcom chipsets with specifications, see Broadcom.

For a list of all currently documented Foxconn device with specifications, see Foxconn.

150 Mbps - 1SS 2.4GHz 802.11n (40MHz chan.) = N150 class

Overview

  • This device is a wireless module in the Nintendo Wii U.
It is visible in iFixit's teardown of the unit.
  • The full part number of the Broadcom chip is BCM43362KUBG.
BCM43362 SDIO: 0xA962 brcmfmac (3.14+)